Jason joined Taiyo America in 2022. Jason manages Taiyo 
America’s Corporate Venture Capital developments, strategic growth initiatives in advanced packaging, and Research & Development group. Taiyo’s strategic investment style fosters a collaborative approach with startups to develop customer pull and geographic reach as part of the investment thesis.
His industry experience extends from both developing new electronic materials to their deployment in power electronics to sensors to advanced digital packaging. The nature of electronics has resulted in a career spanning leading global corporations such as Corning Inc., Sekisui Chemical of Japan, and Wacker Chemie of Germany.
Industry contributions include General Chair of IMAPS Device Packaging Conference 2026, member of the Assembly and Manufacturing Technology and Startup Competition committees for ECTC, PSMA Packaging committee co-chair, 3D-PEIM 2025 Co-chair, plus startup reviewer for NREL’s Industry Growth Conference.
He obtained a PhD in Chemistry from Lehigh University, an MBA from Fordham University and has a BA in Chemistry from Alfred University.